Infineon’s AIROC™ CYW30739 Bluetooth LE & 802.15.4 system on chip is among the first products to support Matter 1.0 running on Thread. The powerful combination of complementary Bluetooth LE and 802.15.4 protocols enhance the performance of smart home products with seamless interoperability and enable end-to-end encrypted communication between individual devices in a Matter network.
AIROC™ CYW30739 Bluetooth LE & 802.15.4 system on chip features a low-power radio, which is a key component in low-power multi-protocol systems with rock solid connectivity. More importantly, it offers superior RF performance for robust connections and best user-experience without connection drops. Its low-power consumption supports applications that require long battery life. The design techniques and process technology used are extremely efficient to help reduce active and idle power.
Key Features
MCU features
- 96-MHz Arm® Cortex®-M4 MCU with floating point unit
- Runs Bluetooth LE stack, Thread, and application
- 1MB flash / 2MB ROM / 512KB SRAM
Multi-protocol subsystem features
- Complies with Bluetooth core specification version 5.3 with LE 2-Mbps support
- Fully compliant IEEE 802.15.4 MAC and PHY
- Certified to Thread 1.3 specification
- Rx sensitivity -95.5 dBm (Bluetooth LE)
- Rx sensitivity -103.5 dBm (802.15.4)
Peripheral Features
- 6×16 bit PWMs
- I2C interface
- SPI interface (master or slave mode)
- Up to 8×20 programmable key-scanning matrix interface
- 1×28 channel ADC (10-ENoB for DC measurement and 12-ENoB for Audio measurement)
Target Applications
- Smart Home
- Smart Building
- Residential Lighting
- Commercial Lighting
- Access control
- Switches
- Door locks
- Sensor nodes
